S1170G
特点
● 耐CAF
● 无铅兼容
● 优异的通孔可靠性
● 不含卤素、锑、红磷等成分
应用领域
● 消费电子
● 智能手机
● 汽车电子
● 电脑
● 仪器仪表
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 180 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 390 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 5.65 x 107 | |
| E-24/125 | MΩ.cm | 2.71 x 107 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 5.99 x 106 | |
| E-24/125 | MΩ | 4.44 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 180 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
|
Dissipation Constant (Dk) RC52% |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.4 | |
| Dissipation Factor (Df) RC52% | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.010 | |
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.3 | |||
| 125℃ | N/mm | 1.1 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. Specification sheet: IPC-4101/130, is for your reference only.
2. All the typical value is based on the 1.6mm(8*7628) specimen.
3. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights fromthis data sheet are reserved by Shengyi Technology Co., Ltd.